Miscellaneous

What is monolithic 3D IC?

What is monolithic 3D IC?

Monolithic 3D ICs are built in layers on a single semiconductor wafer, which is then diced into 3D ICs. There is only one substrate, hence no need for aligning, thinning, bonding, or through-silicon vias. Process temperature limitations are addressed by partitioning the transistor fabrication into two phases.

What is a 3D semiconductor?

3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device.

What is 3D DRAM?

Technology. Monolithic 3D IC technology can be applied to producing a monolithically stacked single crystal silicon double-gated floating body DRAM memory. Lithography steps are shared among multiple memory layers to reduce bit cost. Peripheral circuits below the monolithic memory stack provide control functions.

What is 2.5 D and 3D packaging?

How is 3D Structure different than 2.5D? In 2.5D structure, there is no stacking of dies on dies, but dies are on Silicon Interposer. The dies are packed into a single package in a single plan and both are flip-chipped on a silicon interposer. In 3D structure, Interposer and dies are stacked one above another.

What is 3D processor?

A 3-D chip is an integrated circuit ( IC ) containing a three-dimensional array of interconnected devices performing digital, analog, image processing and neural-network functions, either individually or in combination.

What is TSV in semiconductor?

In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die.

What is DRAM density?

At the beginning of Q4 2019, DRAM semiconductor suppliers started introducing the next-generation high-density DRAM for DDR4. These new chips are based on new wafer lithography which is below 20 nanometers. This means that DRAM is moving from 8Gbit to 16Gbit density, resulting in higher capacities per module.